Adhesive preparation packaging products

Patent Name Adhesive Preparation Package Patent Patent Applicant Nitto Denko Corporation Principal Applicant Address Osaka Prefecture Inventor Ninomiya Nihei; Goshima Shiji Application (Patent) No. 200510082233.1 Date of Application 2005.07.01 Award Date Approval Publication No. 1721289 Examination Announcement date 2006.01.18 Manual Disc number D0603-1 Main classification number B65D77/12(2006.01) I Classification number B65D77/12(2006.01)I;B65D33/16(2006.01)I;A61J1/00(2006.01)I Partition original application No. 2004.7.1 JP 2004-195321; 2005.6.13 JP 2005-172516 Abstract The present invention provides an adhesive formulation packaged product comprising an adhesive formulation and a packaging film encapsulating the formulation, packaging The film is heat-sealed around the adhesive formulation, wherein the heat-sealed portion of the package film includes an embossed heat-sealing portion and a flat heat-sealed portion, and the embossed heat-sealing portion and the flat heat-sealed portion each form a periphery around the adhesive formulation pattern. The adhesive preparation package product of the present invention has no pinholes in the heat-sealed portion, and can maintain excellent airtightness and sterility. Sovereignty Clause 1. An adhesive formulation packaged product comprising an adhesive formulation and a packaging film enclosing the formulation, the packaging film being heat sealed around the adhesive formulation, wherein the heat-sealed portion of the packaging film comprises embossing heat The seal portion and the flat heat seal portion, and the embossed heat seal portion and the flat heat seal portion each form a pattern around the periphery of the adhesive formulation.