A device used in the manufacture of packaging or packaging materials
ã€Patent Type】 Invention Patent ã€Patent Name】 A device used in the manufacture of packaging or packaging materials ã€Applicant】 Tetra Valle Group and Finance Co., Ltd. [Inventor] G. Barra [Address of Principal Applicant] Switzerland Puli [application number] 02804486.X〠Application Date 】 2002.01.31
ã€Approval Announcement No.】 1489540
〠Validation announcement date 】 2004.04.14
〠Main classification number 】 B65B51/22
[Category] B65B51/22 B29C65/04
[Summary Item] 1. A device for the manufacture of packaging or packaging material comprising at least one metal layer and one polymer layer, the device comprising an inductor connectable to a high frequency power source, characterized by The inductor comprises a magnetic core (1) of ferromagnetic conductive material, the core having two shanks (5a, 5b) and carrying between each first end of the shanks (5a, 5b) Air gap (6) and having an arch (7) that connects the second ends of the two shanks (5a, 5b) to each other to conduct magnetic flux (8) between the shanks, The arch portion (7) has a conductive coil (2) wound around it with contacts (3a, 3b, 11a, 11b, 11c) connecting the high frequency power supply (4).
[Instructions CD-ROM] D0415
[Abstract] A device for the manufacture of packaging or packaging materials comprising at least one metal layer or one polymer layer, the device comprising an inductor connectable to a high frequency power source. According to the invention, the inductor comprises a magnetic core (1) of ferromagnetic conductive material, the core having two shanks (5a, 5b) and between the respective first ends of the shanks (5a, 5b) With an air gap (6) and with an arch (7) that connects the second ends of the two shanks (5a, 5b) to each other to conduct magnetic flux between the two shanks (8 ), the arch (7) has a conductive coil (2) wound around it, the coil having contacts (3a, 3b, 11a, 11b, 11c) connecting the high frequency power supply (4).
〠Agency 】 China Patent Agent (Hong Kong) Co., Ltd. [Proxy] Wen Dapeng; Yang Songling