3.1.2 Selection of Packaging Materials
The blister pack has many structural forms, and the single blister base structure and the double blister baseless structure are more suitable for the packaging of weapon maintenance equipment. The packaging material mainly consists of a thermoplastic film for blisters and a substrate for back cover. There are many types of plastic films that can be used for blister packaging. When selecting, the adaptability of plastic films and maintenance equipment must be taken into consideration. That is, the materials used must meet the technical requirements of blister packaging, while minimizing costs. Typical materials for blister packaging are cellulose, styrene, vinyl, polyvinyl chloride, composite aluminum, and the like. Polyvinyl chloride (PVC) has excellent transparency, good thermoformability, and heat sealability. And high gas barrier properties, adding plasticizers can improve the cold resistance and impact strength, the use of better, lower cost, can be used preferentially, the thickness range of 0.10 ~ 0.25mm is appropriate. The substrate is also the main component of the blister package. Like the plastic film, the size, shape, and weight of the device must be taken into consideration when selecting the substrate. The substrate is mainly white cardboard and coated (mainly a heat-sealable coating) corrugated cardboard. Composite materials such as coated aluminum sheets and polyvinyl chloride can be used preferentially due to the good tear-resistance of polyvinyl chloride and blister seals. The thickness range is between 0.07 and 0.15 mm.
3.1.3 Packaging Method Selection
The blister packaging blister has a variety of shapes and sizes, and the shape of the blister package varies depending on the shape of the equipment. At the same time, there are various types of packaging machinery. Therefore, there are many kinds of blister packaging. There are mainly manual operation, semi-automatic mechanical operation, and automatic mechanical operation according to the operation method. class. Due to the wide variety of weapons maintenance equipment and various shapes, there are also many prefabricated blister molds. In order to facilitate the replacement of molds, it is advisable to use semi-automatic mechanical operations. During operation, the blister and the substrate are pre-formed to be printed and punched. When packaging, the device is manually placed in the blister, covered with a substrate, and then placed on a heat sealer for automatic sealing.
3.1.4 Packaging Machinery Selection
Blister packaging machines are mainly blister forming machines and heat sealing machines. The blister forming machine has two heating modes: hot air flow heating and heat radiation heating, in which the heat radiation heating uses radiant heat generated by the heater to heat the material, and the heating efficiency is high; the forming method can be divided into compression molding and blister forming Forming two kinds, plastic forming is to use a vacuum way to make the softening film tightly on the mold to form, the forming quality is better. According to the different heat sealing methods, the heat sealing machine can be divided into ordinary heat sealing, pulse heat sealing, ultrasonic heat sealing and high frequency heat sealing, etc., in which the high frequency heat sealing uses the upper and lower electrodes to compress the heat sealing material, plus the high frequency voltage, The heat seal is performed due to the dielectric loss of the heat seal material. Since the temperature of the sealing portion is the highest for sealing, the material will not be overheated and the sealing strength is high and can be used preferentially.
3.2 Skin packaging
Blister packs, also known as blister packs, are packaged in a breathable, substrate made of cardboard or plastic film, covered with a heat-softened plastic film, and vacuumed through the bottom plate to make the sheet tighter. A packaging method in which a package is wrapped around the substrate and sealed on the substrate. This packaging method is widely used in food, cosmetics, stationery, mechanical parts, daily necessities, toys, etc., and is used in the field of weapon maintenance equipment packaging, and is mainly used for packaging metal spare parts that cannot be completed by single-piece blister packaging.
3.2.1 Main Features Similar to skin packs and blister packs, these packs are all thermoformed packs. Besides the blister packaging features of intuitive packaging, convenient use, and good cushioning, they also have the following features:
a. Skin-to-body packaging does not require a mold. It can package complex shapes of equipment. It is convenient for some larger equipments to be packaged and has a low cost.
b. With good protection, the plastic film can be vacuum-blown and the equipment can be firmly tied on the substrate to ensure that it is not easy to shake during transportation;
c. Because the body packaging substrate must be set aside for vacuum holes, its sealing and gas barrier properties are not as good as those of blister packages. Vapor phase rust prevention must be reformed by adding a layer of plastic film under the substrate. Fit body plastic film heat seal.
3.2.2 Selection of Packaging Materials
Body-fit packaging is similar to blister packs and consists of a plastic film, a heat-sealable coating, and a card substrate. When selecting materials, the size, shape, weight, and other factors of the device should be considered. The focus is on the appearance and endothermic properties of the plastic film. Puncture resistance and deep tensile properties. The most commonly used plastic films are coated polyethylene and ionomers, ie, special body-fitted plastic films. Packaging small and light equipment, with 100 ~ 200um thick ionomer film; packaging large and heavy equipment, with 200 ~ 400um thick polyethylene film. The substrate is usually white cardboard and corrugated cardboard. The corrugated cardboard is porous and can be used without perforation, and the white cardboard must be micro-perforated.
(to be continued)