Patent Type: Invention Patent Inventor: Daiichi; Shinbashio and Division; Fu Yongyang I Applicant: Japan, Inc. Main applicant Address: Hiroshima Prefecture, Japan Application No. 0
Application Date: 2005.08.26
Approval notice number: 1796235
Auditing Announcement Date: 2006.07.05
Main classification number: B65B61/00 (2006.01)I
Classification No.: B65B61/00(2006.01)I; B65B9/02(2006.01)I; B65B9/06(2006.01)I; B65B61/04(2006.01)I
Category classification number:
Priority item: 2004.12.27 JP 375420/2004
Manual CD-ROM: D0627-1
Summary: The present invention provides a package manufacturing method and a package manufacturing system for manufacturing an easy-open package using a film that is not formed into a flaw. The method has a process of superimposing using overlapping films, a process of connecting portions that form a connecting portion on an overlapped film, a process of a side edge that forms a side edge on at least one side edge of the overlapping film, and a process of connecting In the filling treatment of the inner filling contents in the area divided by the portion and the side edge portion, the package for producing the content filled between the overlapping films is formed by the coupling portion formed by the sealing portion of the connecting portion and the side edge portion being sealed. Of the packaging tape connecting tape of the packaging tape, a wound forming process in which a plurality of elongated flaws are formed in a direction substantially perpendicular to the side edge near the side edge of the side edge, and the tape is attached to the packaging body Simultaneously with the pulling, a package connecting tape manufacturing process and a flaw forming process are performed.
Sovereignty Item: 1. A method of manufacturing a package, characterized in that there is overlap processing using an overlap film formed by folding a strip-shaped film in the width direction or overlapping two strip-shaped films. At a predetermined interval in the longitudinal direction, the connecting portion forming the connecting portion in the band shape is processed over the entire width, and at least one side edge of the overlapping film is band-shapedly joined along the side edge to form the side edge of the side edge portion. The processing of the part and the filling process of filling the contents inside the area formed by the connecting part and the side edge part, and manufacturing the content filled between the overlapped films by the connecting part and the The package body formed by the side edge seal is formed by the package connecting tape manufacturing process of the package connecting band formed by the connecting portion, and the side edge of the side edge portion is approximately perpendicular to the side edge. a wound forming process in which a plurality of slender flaws are formed in the direction, and the package body connecting belt manufacturing process and the flaw forming process are performed while the package body connecting belt is being pulled
Agency: Shanghai Xintian Patent Agency Co., Ltd. Agent: Zhong Chengxuan Database Name: Invention Patent Database
Reprinted from: Wanfang Data