Epoxy adhesive formulation twenty-three

Formula one:
618# 100 DTA 8 DBP 20 AL2O3(200 mesh) 100
Curing conditions: pressure (MPa) / temperature °C / time (h) 0.05/20 °C / 24h τ = 18MPa For metal glass and ceramic bonding.
Formula two:
618# 100 Diethylpropylamine 8 DBP 20 AL2O3 100
0.05/20°C/48h τ >20MPa Use Same as above.
Formula 3: HYJ-6#
618# 100 DBP 15 AL2O3 25 2#SiO2 2-5 Tetraethylene pentamine 12
0.05/20°C/48h AL/Glass steel >20MPa Suitable for metal/glass-steel bonding.
Formula 4:
618# 100 Phenylenediamine 18 600# Diluent 10 Resorcinol 10
0.05/20°C/24h τ=17.5MPa τ200°C=5.0MPa for heat-resistant joint bonding.
Formula Five: 913#
Group A: 601# Epoxy 600# Diluent 201# Polyester Aluminum Powder and Quartz Powder B Group: BF3 Diethyl Tetrahydrofuran A3PO4 A: B=10:1
0.05/15°C/6h τ=19MPa Rapid curing at low temperatures is suitable for cold areas.
Formula 6:
Tetrahydrofuran polyether epoxy 5 590# curing agent KH-550 0.2
0.05/30°C/30h τ-196°C=21MPa τ>6.5MPa Suitable for ultra-low temperature metal bonding.
Formula seven: 508#
6101# Epoxy 100 647# Anhydride 60 TiO2 50 Glass Powder 50
0.05/150°C/3h τ=13.1MPa τ steel=26.7MPa Suitable for metal bonding.
Formula eight: 618# 100
Phthalic Anhydride 40 Polyester Resin 20 AL2O3 50
0.05/140°C/4h τ>20MPa τ150°C=8-10.0MPa Use Same as above.
Formula 9:
618# 100 650# polyamide 0.05/20°C/24h 100-120 τ>15MPa Used for metal plastic ceramic wood bonding.
Formula 10: KH-514#
Group A: 618# 2000# Epoxy Resin Group B: 651# Polyamide DMP-30 KH-560 Mixed amine (m-Phenylenediamine: 4,4'-Diaminodiphenylmethane)
A:B=12:7
0.05/60°C/3h τ≥25MPa for metal bonding.
Formulation 11: J-11# plastic 6101# epoxy resin 120 200# polyamide 100 600# thinner 24 phenylenediamine 6.5
KH-50 2.5
0.05/20°C/24-36h τ-120°C=15Mpa τ≥20Mpa τ120°C=3.0~4.0Mpa Metal bonding.
Formulation twelve: 250# glue 4,4-dihydroxydiphenyl sulfone epoxy 100 618# 100 200# polyamide 200D-1
7 Epoxy resin 20 Liquid nitrile 10 Amount of acetone 0.05/50°C/16 τ=40MPa Suitable for high strength metal bonding.
Formula 13: 711#
Group A: 6101# epoxy resin 40 634# epoxy resin 40 600# diluent 20 dioctyl sebacate 10
Group B: 651# Polyamide 38.5 A: B=100:35
0.05/25°C/24h τ-40°C=21.9Mpa τ=28.0Mpa τ50°C=12.8Mpa For bonding of metal plastics and ceramics.
Formula 14: E-12#
Group A: Urethane tetrafunctional epoxy resin 20 Polyethylene oreacetaldehyde 20 Ethyl orthosilicate 1
Group B: 2E4BZ 2 Acetone: Normal Alcohol (7:3) 8
A: B = 41:10
0.02/120°C/4h τ>20Mpa, 150°C=12MPa metal bonding.
Formula 15:
618# 100 Ethyl Orthosilicate 8 DTA 8
0.05/20°C/24h τ20°C>16MPa τ100°C>11MPa (good water resistance), cermet bonding.
Formula sixteen: MS-2#
6101# epoxy resin 100 JLY-121# polysulfide 10 microcapsules (containing 4,4'-diaminodiphenylmethane) 50
0.05/130°C/2h τ=25MPa τ120°C=4.0MPa Metal bonding.
Formula 17: Agricultural Machinery - 2#
A: 6101# epoxy 100 DBP 15 quicklime (160 mesh) 30
B: DTA (50%) 20 DMP-30 (31.4%) 20 Thiamine (18.6%) 20
25°C/2~3h τ=16~18MPa Uniform tear strength>1.5MPa Metal and wood glass bonding.
Formula 18: KH-802#
618# 100 CTBN 15~25 Dicyandiamide 9 2#SiO 2 2~3
150~160°C/3h τ≥30MPa Metal bonding.
Formulation 19: HY911-III
Group A: 618# hydroxyl-terminated polybutadiene quartz powder 2#SiO2
Group B: 634# epoxy resin tetrahydrofuran H3PO4 A: B=3-9:1
30°C/3h τ=24.3MPa Rapid repair of structural adhesive at room temperature.
Formula 10: 618 #, JLY-121 # polysulfide, curing agent τ45 # steel ≥ 35MPa is a plastic glass bonding.
Formula XI: KH-223#
618# 100 CTBN 25 to 35 2E4ME 10 2#SiO2 0 to 2
0.05/80°C/4h τ≥30MPa τ 100°C≥15MPa Metal bonding.
Formulation twelve: HYJ-29#
618# 100 CTBN 16 Al2O3 25 2E4BZ 8 2#SiO2 2 to 5
0.05/70°C/3h τ>11MPa τ110°C>9MPa Metal/FRP bonding.
Formulation 13: KH-511#
618# 100 Butyronitrile-40 18-20 Phenylenediamine 14 2E4BZ 4
0.05/120°C/3h τ>30MPa τ100°C≥25MPa Metal bonding (below 100°C).
Formula 14:
AG-80# 100 Polyvinyl butyral 100 Ethyl orthosilicate 5 Acetone: Ethanol = 7:3 40
See recipe 44 for curing conditions and properties.
Formula 15: HY-914#
Group A: 711# epoxy 70 712# epoxy 52 601# epoxy 20
LP-2 Polysulfide (JLY-124#) 20 Quartz Powder 40 2#SiO2 2
Group B: 703 curing agent 36 DMP-30 1 KH-550 2 A: B=5-6:1
0.05/25°C/3h (E-20) τ=23~25MPa T-type peel strength 0.23MPa Metal, plastic, ceramic bonding.
Formulation 16: HY-914II
Group A: 711# 712# 601# JLY-124 polysulfide quartz powder (270 mesh) 2#SiO2
Group B: 701 Hardener DMP-30 KH-550 2#SiO2 Quartz Powder A:B=2.5:1
0.05/25°C/6~8h τ=15~20MPa T-type peel strength 0.35MPa Metal-glass-ceramic Perspex ABS Polyamide Adhesive.
Formula 17: Aircraft glue 1#
Group A: 6101# epoxy resin 100 662# epoxy resin 8 LP-3 polysulfide (JLY-121#) 30
Zinc powder 100
Group B: imidazole-amine curing agent 16 metal bonding DMP-30 6 KH-550 3 Note: imidazole-amine curing agent (618# and 2E4BZ1:1 mixed for 2h and 2 parts of DTA reacted at 50°C for 1h) A:B =1:1
0.05/20°C/24h τ-60°C=16-17MPa τ=21-23MPa τ60°C=17-19MPa.
Formula 18:
618# 80 D-17# 20 300# Polyamide 10 2E4BZ 5 Aluminum Powder 20~25
80°C/8h τ=23MPa τ100°C=15MPa Metal bonding.
Formula 19:
618# 100 JLY-121# Polysulfide 30 650# Polyamide 30 Hexahydropyridine 5
100°C/3h τ=28MPa Non-uniform tear strength of 450N/cm metal bonding.
Formula 20:
618# 100 JLY-121# 20 Diamine 10 Hexamethylenetetramine 5 Quartz Powder 50
20°C/24~48h+60°C/4h τ=15MPa τ100°C=4MPa The active period is 2~3h.
Formula twenty-one:
618# 100 Butyronitrile-40 16 647# Anhydride 80 2E4BZ 2
1.0/120°C/3h τ=27.3MPa τ-60°C=22.4MPa τ200°C=2.6MPa The maximum operating temperature is
200 °C.
Formula twenty-two:
E-42 100 Benzophenone dianhydride 48 Aluminum powder (325 mesh) 100 2#SiO2 3
After 200°C/2h τ=17.5MPa τ260°C=8.6MPa 260°C aging for 103h, the strength retention was 85%.
Formula twenty-three:
618# 100 W-95 Epoxy Resin 100 4,4-Diaminodiphenylmethane 116 KH-550 4 Butyronitrile-38 20
150°C/3h τ=31.5MPa τ150°C=18.8MPa Metal bonding.

 In the high-speed cnc milling process, the deformation of the part can be reduced due to the small cutting force, which is more suitable for the aluminum alloy workpiece, and the chip is cut off in a short time, most of the cutting heat is carried away by the chip, and the thermal deformation of the workpiece is small. Conducive to the dimensional accuracy of the parts. The cutting performance of aluminum alloy cnc milling parts is good, but the parts are easily deformed if the process plan or setting is improper during the milling process, resulting in dimensional errors.

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